Recently, an IEEE Fellow Award was presented to Prof. Kou-Ning Chiang of the Institute of Electrical and Electronics Engineers for his outstanding contribution to the analysis of microelectronic packaging, mechanical and electronic components, basic and applied research, and verification of design and reliability assessment. Prof. Chiang is the first faculty member of mechanical engineering to receive both IEEE Fellow and ASME Fellow.

Prof. Chiang is currently the Editor-in-Chief of Transactions on Components, Packaging and Manufacturing Technology Journal (IEEE Transaction on CPMT), as well as one of the seven IEEE-CPMT Board of Governors. He attended many important IEEE/ASME international conferences as program chair/co-chair, technical program chair, session chair and keynote speaker, which clearly indicated his influence on foreign and domestic microelectronic packaging research. Prof. Chiang has published over 300 papers on microelectronic packaging/MEMS in nanotechnology related journals. He also holds 52 patents with several 3D stack packaging (such as Taiwan patent I400589, I269460, I264103, US7884464, US20080142941) incorporated into the packaging structural roadmap.

Prof. Chiang's research focused on the Design on Simulation and Simulation Based Science and Technology. During his two years of affiliation with the National Center for High-Performance Computing as its Director, super computer--- FORMOSA 4 and FORMOSA 5 were designed under his directorship and took a spot in the top 500 supercomputers in the world. Moreover, Prof. Chiang invested a great amount of effort into the unification of technology and humanity; for example, the Smart Cloud Render Farm System built by his research team is widely received by the cultural and creativity industries and is instrumental in the newly emerged 3D animation in Taiwan.